IMPORTANT DATES

February 15, 2008:
Submission of proposals for Special Sessions and Tutorials
March 20, 2008:
Submission of full papers, Midnight PST
April 30, 2008:
Acceptance notification of Tutorials and Workshops
May 30, 2008:
Acceptance notification to authors
June 27, 2008:
Final camera-ready papers due
May 30, 2008:
Advance conference registration starts
August 1, 2008:
July 16, 2008:
Late conference registration begins

RECENT UPDATES AND QUICK LINKS

 

NEW - August 14, 2008:
NEW - August 14, 2008:
NEW - August 14, 2008:
NEW - August 14, 2008:
NEW - July 28, 2008:
April 30, 2008:
April 25, 2008:
April 25, 2008:
April 4, 2008:
Plenary Speakers for IEEE CASE 2008 Announced

(right click image below to download the poster for IEEE CASE 2009!)

 

IEEE CASE 2008 Sponsors

IEEE CASE 2008 Proudly Announces Toyota as a Bronze Sponsor

IEEE CASE 2008 Proudly Announces ABB and Siemens as Sponsors



                                                                                                                                                  (Right Click Program Cover to Download)

Welcome to the fourth annual IEEE Conference on Automation Science and Engineering, IEEE CASE 2008. This conference provides a forum for researchers, academicians, and industry practitioners to discuss, provide broad coverage, and disseminate foundational research on automation.

CASE is an offspring of IEEE Transactions on Automation Science and Engineering, IEEE T-ASE, www.ieee.org/t-ase. High quality CASE papers will be recommended for publication in this flagship automation journal. The latest news on T-ASE can be found in:


The IEEE CASE 2008 Conference includes:

  • Plenary Speeches by prominent researchers/practitioners in automation fields.
  • Oral presentations of papers in parallel organized sessions.
  • Panel discussions by leaders in automation research and applications.
  • Workshops on fields of interest to the automation community.

Technical Program will consist of 21 technical tracks featuring:

  • Automation/Assembly for Micro/Nano Technologies
  • Automation in Life Sciences & Laboratory Automation
  • Construction Automation
  • Distributed Control Systems
  • Health Care Delivery Engineering
  • Hybrid and Discrete-Event Systems
  • Information-Based Manufacturing
  • Internet Analytics and Automation
  • Manufacturing Systems
  • Networked Industrial Automation
  • Planning, Scheduling, and Coordination
  • Reconfigurable Automation Systems
  • RFID Application
  • Semiconductor Manufacturing
  • Sensors, Instrumentation, and Measurement
  • Sensor Networks and Fusion
  • Service/Home Automation
  • Supply Chain, Logistics, and Transportation
  • System Modeling and Simulation
  • Vision in Automation
  • Wireless Automation

Author(s) should submit full papers electronically in double column IEEE-compliant PDF format. All papers will be peer-reviewed. Accepted papers will have a choice for oral and/or poster presentations, and published in CD-ROM.  Posters will be displayed throughout the conference and Poster Sessions will be scheduled for author/audience interaction. Six pages are allowed per paper, and detailed instructions for paper preparation and submission will be available on the conference web site: http://www.ieee-case.org.

AWARDS

IEEE CASE 2008 is proud to support awards for Best Conference Paper, Best Application Paper, and Best Student Paper.

In 2008 the Best Conference Paper is sponsored by Spansion, Inc., the world largest NOR Flash memory provider with its headquarters in Silicon Valley. QSI's Intelligent Software Solutions enable OEMs and Service and Maintenance organizations to reduce the design, development, support time and costs associated with complex, and critical equipment and systems.

IEEE CASE 2008 is proud to annouce a 5 year sponsorship from Qualtech Systems Inc. (QSI) for the Best Application Paper. The QSI Best Application Paper Award will be awarded each year to the paper that best represents applied advances in engineering science toward high-impact applications. QSI's Intelligent Software Solutions empower and enable OEMs and Service and Maintenance organizations to provide the highest quality of service economically by significantly reducing troubleshooting time and increasing the level of equipment availability.  QSI Equipment Health Management and QSI Integrated Diagnostics solutions are proven, mature and deployed worldwide. Some of QSI customers include NASA, Boeing (BA), FEI Company (FEIC), Honeywell (HON), Lockheed Martin (LMT), KLA-Tencor Corporation (KLAC), Orbotech Ltd. (ORBK), and United Technologies (UTX).  The company's quality management system is certified to ISO9001:2000 standards. Founded in 1993, QSI is a privately owned company, based in Wethersfield, CT with representatives in China and Israel. QSI has received awards from NASA and Aviation Week and Space Technology.  For more information visit http://www.teamqsi.com.

The Best Student Paper is sponsored by General Motors, Corporation, a leader in the application of automation and science in engineering applications. The awards are intended to set and honor a standard for excellence in engineering science, and to inspire future directions in automation. 

IEEE CASE 2007 Spansion, Inc. Best Conference Paper (Co-winners)

Autonomous Zebrafish Embryo Injection Using a Microrobotic System (download pdf)

Wang, Wenhui

Univ. of Toronto

Liu, Xinyu

Univ. of Toronto

Sun, Yu

Univ. of Toronto


Algorithm Advancements for the Measurement of Single Cell Oxygen Consumption Rates (download pdf)

Molter, Timothy

Univ. of Washington

McQuaide, Sarah

Univ. of Washington

Zhang, Meng

Univ. of Washington

Holl, Mark

Arizona State University

Burgess, Lloyd

Univ. of Washington

Lidstrom, Mary

Univ. of Washington

Meldrum, Deirdre

Arizona State University

IEEE CASE 2007 Google, Inc., Best Student Papers (Co-winners)

Dynamic Modelling of Wheel-Terrain Interaction of a UGV (download pdf)

Tran, T. H.

Univ. of Tech., Sydney

Kwok, Ngai Ming

Univ. of Tech., Sydney

Scheding, Steven

Univ. of Tech., Sydney

Ha, Q P

Univ. of Tech., Sydney


Automation and Yield of Micron-Scale Self-Assembly Processes (download pdf)

Saeedi, Ehsan

Univ. of Washington

Kim, Samuel

Univ. of Washington

Etzkorn, James

Univ. of Washington

Meldrum, Deirdre

Arizona State University

Parviz, Babak

Univ. of Washington

IEEE CASE 2008 Sponsorship (For Sponsorship Levels Click Here)

The 4th annual IEEE Conference on Automation Science and Engineering offers a unique opportunity for sponsor to support a nexus venue for engineering science.  This unique venue brings together the full spectrum of disciplines that comprise the application of automation as a ubiquitous tool that enables and in many ways regulates and runs modern societal life.  Sponsors enjoy privileged access to a spectrum of the most talented interdisciplinary engineers.  Benefits to sponsors include access to these experts, recruitment of talented graduates, and exposure to a broad audience through conference proceedings and being featured on the Conference website.

IEEE Logo   IEEE Robotics and Automation Society Logo

IEEE CASE is sponsored by the IEEE Robotics and Automation Society

IEEE CASE 2005, IEEE CASE 2006, IEEE CASE 2007, IEEE CASE 2008 and all subsequent CASE manuscripts are available for download through IEEE Xplore and all abstracts are available in the Elsevier databases Engineering Index (EI) and Compendex.